TECHNOLOGY

facts | editorial | quality | innovation | technology | customer service | exchange of ideas | history |
how to find us: Wangs (CH) | Ulm (D)
 

FOCUS ON APPLICATION-ORIENTATED TECHNOLOGY

Qualitative advances. Within our field we offer you a wide range of products and mature technologies. Our decision to operate exclusively in the market niche of thin film technology shows our dedication to quality. This is because repeatedly working through and refining known methods brings to light new qualitative advancements.
Environment. We pay strict attention to the environment-friendliness of our production methods. For example, all products are manufactured without the use or emission of CFCs.

Quality assurance. To ensure that our products meet the required quality standards, they are tested in electrical and optical interim and final examinations according to your specifications and internationally recognised standards. This guarantees that our products are reliable, precise, stable and optimally durable.

RANGE OF TECHNOLOGY

Substrate materials

You can choose between aluminium oxide ceramics (Al2O3), aluminium nitride ceramics (AlN), quartz (SiO2), glass, silicon (Si/SiO2 wafer) and saphire as the substrate for your product. Our thin films are also available on flexible substrates such as Kapton foil, Teflon foil, Duroid etc. Looking for the correct substrate material for your circuits? ­ We have it.

lay_2.jpg (10961 Byte)

Layout design / mask production

We transfer your data files to our CAD system and process them according to our design rules or develop the desired product together with you. Working closely with the mask shop ensures that the mask set can be realised quickly.
back to the top

Substrate pre-treatment

In order to ensure optimum adhesion and a low defect density of the thin films, it is essential that the substrates be correctly pre-treated and intensively cleaned. These specially developed processes guarantee a stable product ­ today and in the future.

Metallic coatings

The metal layers with tight tolerances are applied using the reliably reproducible sputtering technology, a vacuum deposition process, in combination with electroplating processes. Our standard resistance layers are based on NiCr and Ta2N and are among the best in the world. Sheet resistances of up to 300 ohms/sq. with excellent temperature coefficients and long-term stability values are achieved. Electroplated layers of Ni, Cu or Au, depending on the application, enable reliable soldering and wire bonding.

back to the top

Patterning

Minimum line and space widths can be achieved with our mature photolithography processes. Typical values are <10 µm on Si/SiO2 wafer and polished Al2O3 as well as on glass substrates. We use two different processes:

Subtractive process (Maximum layer thickness of 10 µm)

The vacuum sputtered and overlaying electroplated metal layers are etched using wet-chemical processes or dry etching processes.

Semi-additive process (Layers thicker than 8 µm)

The thickness of the vacuum deposited conductor lines bared by the selective removal of the photosensitive resist is increased by electroplating.

Insulation layers

For multilayer systems (MCM-D up to five layers), insulating intermediate layers with light-sensitive polyimides are applied in a spinning process. Vias of >30 µm in the polyimide layer as well as plated-through holes in carrier ceramics of >250 µm can be realised. As our speciality, we offer MCM-D with integrated resistors and direct connections to the metal coating on the back of the substrate.
back to the top

Laser trimming

The resistors can be adjusted up to an absolute tolerance of
+/- 0.02% and a ratio of +/- 0.01% with the laser trimmer. This means maximum accuracy for precision resistors.

Passivation and post-processing of substrates

If required, the patterned substrates can be protected against mechanical damage and environmental influences (passivation) by means of a synthetic layer (resist or polyimide).

With a CO2 laser, it is possible to create cut-outs on the substrate or to give the substrate an asymmetrical shape after the layers have been structured.

Separation of the substrates

To reduce costs, the substrates are pre-scribed with a CO2 laser and then broken apart.

High precision parts are cut with a diamond saw.

back to the top

thin film technology for microelectronics